Hitzebeständige Klebstoffzusammensetzungen und Verfahren zur Bindung damit

• Main Authors: SUZUKI, MASAKATSU, SHIMODATE-SHI, IBARAKI-KEN, JP, SATOU, EIKICHI, OYAMA-SHI, TOCHIGI-KEN, JP, SAKAIRI, KOUSHI, SHIMODATE-SHI, IBARAKI-KEN, JP, NOMURA, HIROSHI, OYAMA-SHI, TOCHIGI-KEN, JP, NAGAO, KOUICHI, SHIMODATE-SHI, IBARAKI-KEN, JP, IMAIZUMI, JUNICHI, SHIMODATE-SHI, IBARAKI-KEN, JP
• Format: Patent
• Language: German
• Published: 20.07.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.