ABBILDUNGSVORRICHTUNG

Assembly of sensors formed as an imager with a detection brick including a photosensitive material, a brick for addressing and optionally processing signals from the sensor(s), an interconnection brick located between the detection brick and the addressing brick, this brick including connection pads...

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Main Authors GUEDJ, CYRIL, MOUSSY, NORBERT, ALVAREZ, JOSE, KLEIDER, JEAN-PAUL, BONNASSIEUX, YVAN, TCHAKAROV, SVETOSLAV, ROCA I CABARROCAS, PERE
Format Patent
LanguageGerman
Published 05.02.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Assembly of sensors formed as an imager with a detection brick including a photosensitive material, a brick for addressing and optionally processing signals from the sensor(s), an interconnection brick located between the detection brick and the addressing brick, this brick including connection pads, characterized in that the photosensitive material of the detection brick contains polymorphous silicon. The invention also relates to a method for the making of the latter.
Bibliography:Application Number: DE20036018848T