Verpackung für Halbleitervorrichtung und deren Herstellungsverfahren

A semiconductor device (1) comprises a semiconductor element (2) having a signal electrode (2a) and a ground electrode (2a). A mounting part metallic film (4) has a bottom area on which the semiconductor element (2) is mounted and a stepped area (4a) located at a periphery of the bottom area and bei...

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Bibliographic Details
Main Authors KOBAYASHI, TSUYOSHI, FURUHATA, YOSHIO
Format Patent
LanguageGerman
Published 12.07.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device (1) comprises a semiconductor element (2) having a signal electrode (2a) and a ground electrode (2a). A mounting part metallic film (4) has a bottom area on which the semiconductor element (2) is mounted and a stepped area (4a) located at a periphery of the bottom area and being higher in horizontal level than the bottom area. A connector part metallic film (5) is spaced from the mounting part metallic film (4) and arranged at a peripheral region thereof. The signal electrode (2a) of the semiconductor element (2) is electrically connected to the connector part metallic film (5) and the ground electrode (2a) of the semiconductor element (2) is electrically connected to the stepped area of the mounting part (4) metallic film. The semiconductor element (2) is shielded with resin (7) together with mounting/connecting sides of the mounting part metallic film (4) and the connector part metallic film (5).
Bibliography:Application Number: DE20006033901T