HALBLEITERGEHÄUSE, HALBLEITERVORRICHTUNG, ELEKTRONIKELEMENT UND HERSTELLUNG EINES HALBLEITERGEHÄUSES

An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening po...

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Bibliographic Details
Main Authors SADAKATA, NOBUYUKI, MASUMOTO, MUTSUMI, INABA, MASATOSHI, MASUMOTO, KENJI, KAIZU, MASAHIRO, OMINATO, TADANORI, SUZUKI, TAKANAO, KUROSAKA, AKIHITO
Format Patent
LanguageGerman
Published 22.06.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
Bibliography:Application Number: DE20006022458T