CCD housing structure assembly - uses automatically bondable foil with numerous outer and inner leads, and chip bonding straps

The CCD structure assembly starts with a foil for automatic bonding with a number of outer and inner leads and chip bonding straps. The chips are bonded onto the latter, followed by bonding of the undersides of each free end of the inner leads to the bonding islands of the chips. Then a light screen...

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Bibliographic Details
Main Author KO, JUN SOO, SEOUL/SOUL, KR
Format Patent
LanguageEnglish
German
Published 23.04.1992
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The CCD structure assembly starts with a foil for automatic bonding with a number of outer and inner leads and chip bonding straps. The chips are bonded onto the latter, followed by bonding of the undersides of each free end of the inner leads to the bonding islands of the chips. Then a light screening layer is formed, whose both edges are secured to certain regions of each outer lead under the chip. A glass element is secured to each surface portion of the inner leads, directly above the chip. Then the spacers are removed by a cutting step, and the outer leads are shaped to the required configuration. Pref. the glass has the same shape of its surface as the chip. ADVANTAGE - Lightweight housing design and simple laminate structure.
Bibliography:Application Number: DE19914133183