HERSTELLUNGSVERFAHREN FUER ABSOLUTDRUCKWANDLEREINHEITEN MIT HALBLEITERN
A method for manufacturing semiconductor absolute pressure sensor units includes anodically bonding a silicon sensor wafer (10) and a silicon cap wafer (12) with a borosilicate glass layer (32) disposed threbetween so as to surround respective sensor chips on the silicon sensor wafer (10) by introdu...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | German |
Published |
03.12.1992
|
Edition | 5 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!