VERFAHREN ZUR UNMITTELBAREN VERBINDUNG EINER KUPFERFOLIE MIT EINEM SUBSTRAT AUS ELEKTRISCH ISOLIERENDEM MATERIAL

• Main Authors: HUBERT, JEAN-CLAUDE, SUCY EN BRIE, FR, MARTIAL, MARIE-FRANCOISE, PUTEAUX, FR, GUINET, JANNICK, SOISY SOUS MONTMORENCY, FR
• Format: Patent
• Language: German
• Published: 18.05.1989
• Subjects: ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CEMENTS; CERAMICS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LIME, MAGNESIA; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; REFRACTORIES; SEMICONDUCTOR DEVICES; SLAG; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF NATURAL STONE; WELDING; WORKING BY LASER BEAM

Disclosed is a method for the direct bonding of a copper sheet to a substrate made of an electrically insulating material, with the heating of the copper/substrate set in order to obtain a eutectic mixture. The method according to the invention consists in cleaning the copper to eliminate traces of oxidation on its surface before placing said copper on the substrate, in heating the copper/substrate set under a neutral atmosphere until a temperature greater than the temperature for the formation of the eutectic mixture is reached, and in applying the oxidating reactive gas only after the temperature greater than the temperature for the formation of the eutectic mixture is reached, in such a way that this temperature is reached before any oxidation of the surface of the copper.