Process for producing a dry-film photoresist

A dry-film photoresist is disclosed, which is suitable for use in the fabrication of printed circuit boards and comprises a photopolymerisable layer which is laminated between a covering film and a carrier film and which adheres more strongly to the covering film than to the carrier film, and in whi...

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Bibliographic Details
Main Authors SCHAAKE, SCOTT GLEN, HOCKESSIN, DEL., US, FIFIELD, CHARLES CALHOUN, WILMINGTON, DEL., US, ROACH, DONALD JOSEPH, SWEDESBORO, N.J., US
Format Patent
LanguageEnglish
German
Published 09.02.1989
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
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Summary:A dry-film photoresist is disclosed, which is suitable for use in the fabrication of printed circuit boards and comprises a photopolymerisable layer which is laminated between a covering film and a carrier film and which adheres more strongly to the covering film than to the carrier film, and in which the carrier film is located on the inside of the roll; also disclosed is an improved process for producing the dry-film photoresist.
Bibliography:Application Number: DE19883825782