LAGERSTABILE WAESSRIGE POLYMERDISPERSIONEN

• Main Authors: PFOEHLER,PETER,DR, NEUBERT,GERHARD,DR, JAEGER,HELMUT, DRUSCHKE,WOLFGANG,DR, OSTERLOH,ROLF,DR, AUCHTER,GERHARD,DR, SCHWERZEL,THOMAS,DR
• Format: Patent
• Language: German
• Published: 05.01.1989
• Edition: 4
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; WORKING-UP

The polymer dispersions are obtainable by dispersing a mixture of 15 - 70% by weight of a copolymer (A) comprising (I) 1.5 - 15% by weight of copolymerisable compounds containing 3 to 10 carbon atoms and one carboxyl or carboxylic anhydride group, (II) 65 - 98.5% by weight of C1- to C20-alkyl acrylates or methacrylates, (III) 0 - 20% by weight of vinylaromatic compounds, (IV) 0 - 20% by weight of copolymerisable carbonyl compounds, (V) 0 - 10% by weight of further copolymerisable organic compounds not mentioned under (I) to (IV), and 30 - 85% by weight of a copolymer (B) comprising 60 - 100% by weight of monomers (II) and 0 - 40% by weight of monomers (III) to (V), with the proviso that the copolymers (A) and (B) together contain more than 65% by weight of alkyl (meth)acrylates (II) as synthesis component whose homopolymers have glass transition temperatures of below 0 DEG C, and that at least one of the copolymers (A) and (B) contains the monomers (IV) as synthesis component, in water with addition of ammonia and a polyhydrazide (C). The dispersions are used as contact adhesives and as adhesives for multilayer films.