Method of depositing a copper/phosphorus layer on copper materials and application of the method

In the method of depositing a copper/phosphorus layer, the copper material is copper-plated in a copper-plating bath containing dispersed elemental red phosphorus. Such an electrodeposited copper/phosphorus layer can be used, for example, to join parts made of copper materials by resistance brazing....

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Bibliographic Details
Main Authors REITH,HERIBERT, SCHROLL,GUENTER,.DR, SITKA,PETER, OTT,RUDI,.DR, DE,.PAOLI,ALBANO, LANDER,HANS,.DR
Format Patent
LanguageEnglish
German
Published 13.01.1983
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:In the method of depositing a copper/phosphorus layer, the copper material is copper-plated in a copper-plating bath containing dispersed elemental red phosphorus. Such an electrodeposited copper/phosphorus layer can be used, for example, to join parts made of copper materials by resistance brazing. The strength values of such joints are in no way inferior to those which have been soldered with conventional silver solder.
Bibliography:Application Number: DE19813121826