Wireless chip resistor, using thin alloy film on polyimide foil - esp. for use in automatic machines fixing the resistors on printed circuit boards
A polyimide substrate foil is coated with an NiCr resistor film which may be calibrated to obtain a desired resistance value. The resistor film is provided with thicker contact zones; and both the film and the zones are covered with an adhesive which bonds a covering polyimide foil contg. holes for...
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| Main Author | |
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| Format | Patent |
| Language | English German |
| Published |
07.01.1982
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| Subjects | |
| Online Access | Get full text |
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| Summary: | A polyimide substrate foil is coated with an NiCr resistor film which may be calibrated to obtain a desired resistance value. The resistor film is provided with thicker contact zones; and both the film and the zones are covered with an adhesive which bonds a covering polyimide foil contg. holes for solderable electric contacts. The chip resistor is pref. made by evaporating an NiCrCu film onto a substrate foil strip, then thickening the Cu film electrolytically in local contact zones. Photo-etching is then used to shape the resistor film and contacts; and a laser is used to adjust the resistance value. A very simple design permitting easy mass prodn. and possessing high mechanical stability. |
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| Bibliography: | Application Number: DE19803023133 |