Prodn. of opto-coupler formed by LED and phototransistor - uses separate securing of diode and transistor, involving grooved metallised multilayer board for diode and flat board for transistor

• Main Authors: SONST,PETER, WILCZEK,PETER
• Format: Patent
• Language: English; German
• Published: 07.08.1980
• Edition: 3
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The prodn. uses adjacent chips so that the output of the LED is directly received by the phototransistor. The diode and phototransistor are separately prod. and mounted together on a ceramic support. The diode (D) is mounted in a multi-faed bridge structure metallised (M) on the inside. A channel (N...