Prodn. of opto-coupler formed by LED and phototransistor - uses separate securing of diode and transistor, involving grooved metallised multilayer board for diode and flat board for transistor

The prodn. uses adjacent chips so that the output of the LED is directly received by the phototransistor. The diode and phototransistor are separately prod. and mounted together on a ceramic support. The diode (D) is mounted in a multi-faed bridge structure metallised (M) on the inside. A channel (N...

Full description

Saved in:
Bibliographic Details
Main Authors SONST,PETER, WILCZEK,PETER
Format Patent
LanguageEnglish
German
Published 07.08.1980
Edition3
Subjects
Online AccessGet full text

Cover

Loading…