Pressure sensitive adhesive - contng acrylic polymers

A non-solvent type composition with Williams plastic No. 1.5 and containing one or more lower polymers capable of improving adhesive strength by treatment with ionizing radiation, is heated and treated with ionizing radiation. The pref. polymeriziable hot melt type composition has melt viscosity 500...

Full description

Saved in:
Bibliographic Details
Main Authors MORRIS CHRISTENSON,ROGER, CLEMENT ANDERSON,CARL
Format Patent
LanguageEnglish
German
Published 28.12.1972
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
Online AccessGet full text

Cover

More Information
Summary:A non-solvent type composition with Williams plastic No. 1.5 and containing one or more lower polymers capable of improving adhesive strength by treatment with ionizing radiation, is heated and treated with ionizing radiation. The pref. polymeriziable hot melt type composition has melt viscosity 500-100,000 P at 350 degrees F and includes acrylic polymers obtained by polymerizing C4-12 alkyl acrylate, C6-12 alkyl methacrylate and copolymer of butyl acrylate and vinyl acetate or of 2-ethylhexyl acrylate, vinyl acetate and acrylic acid.
Bibliography:Application Number: DE19712131059