Process for metallically coating high temperature superconductors comprises galvanically applying copper and a metallic copper sample as anode, and partially covering between the anode and the high temperature superconductor

• Main Authors: ROTHFELD, ROLF, FLOEGEL-DELOR, UTA, WERFEL, FRANK, WIPPICH, DIETER
• Format: Patent
• Language: English; German
• Published: 24.05.2012
• Subjects: APPARATUS THEREFOR; ARTIFICIAL STONE; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LIME, MAGNESIA; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; REFRACTORIES; SLAG; TREATMENT OF NATURAL STONE

Process for metallically coating high temperature superconductors having a copper-oxygen base structure comprises galvanically applying copper especially using a CuSO 4solution as electrolyte and a metallic copper sample as anode, and partially covering between the anode and the high temperature superconductor as cathode to produce metallic structures on the surface using a regulating direct current source. Preferred Features: The cathode is a high temperature superconductor in the form of a thick and/or a thin layer on a substrate. Verfahren zur galvanischen metallischen Beschichtung eines Hochtemperatur-Supraleiters (HTSL) mit einer Kupfer-Sauerstoff Grundstruktur, insbesondere eines RE-Supraleiters (RE = Y, Nd, Sm, Yb) oder eines Wismut-Supraleiters, mittels eines wässrigen Kupfersulfat-Bades bei kathodischer Polarität des Hochtemperatur-Supraleiters, dadurch gekennzeichnet, dass bei Einsatz eines Hochtemperatur-Supraleiters mit einem spezifischen elektrischen Widerstand im Bereich von 0,5 bis 1,0 m cm die Beschichtung mit einer elektrolytischen Stromdichte von größer 0 bis zu 200 mA/cm2 aufgebracht wird.