Leistungshalbleitermodul mit in Submodulen integrierten Kühlern

The module (1) has a number of sub-modules (2) with at least one semiconducting chip (3) attached to the top of an electrically insulating, heat conducting substrate (6) with a thermal expansion coefficient matching that of the chip. One sub-module (2) directly in the substrate has a cooler (7) of a...

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Bibliographic Details
Main Authors ZEHRINGER, RAYMOND., MUTTENZ, CH, ETTER, PETER, OBEREHRENDINGEN, CH, STUCK, ALEXANDER., WETTINGEN, CH
Format Patent
LanguageGerman
Published 18.02.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The module (1) has a number of sub-modules (2) with at least one semiconducting chip (3) attached to the top of an electrically insulating, heat conducting substrate (6) with a thermal expansion coefficient matching that of the chip. One sub-module (2) directly in the substrate has a cooler (7) of a good thermal conductor. The cooler is embedded in the underside (6b) of the substrate.
Bibliography:Application Number: DE1997135531