X=ray lithography mask useful in semiconductor industry
Novel X-ray mask comprises a membrane (41) having an oxide layer provided with an absorber pattern, the membrane being supported on a substrate (40) which exposes a membrane region in which the absorber pattern is located. Preferably, the oxide layer (43) consists of Al2O3, MgO or ITO. Also claimed...
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Main Authors | , , , |
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Format | Patent |
Language | English German |
Published |
05.03.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | Novel X-ray mask comprises a membrane (41) having an oxide layer provided with an absorber pattern, the membrane being supported on a substrate (40) which exposes a membrane region in which the absorber pattern is located. Preferably, the oxide layer (43) consists of Al2O3, MgO or ITO. Also claimed is an X-ray mask production process involving: (a) forming first and second oxide layers on a membrane formed on a substrate; (b) etching a predetermined portion of the substrate to expose the membrane; (c) structuring the second oxide layer to form a pattern; (d) forming an absorber (47) over the entire surface; and (e) etching the absorber to expose the surface of the pattern which is then removed to form an absorber pattern on the first oxide layer. Further claimed is a similar X-ray mask production process in which the first oxide layer is omitted. |
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Bibliography: | Application Number: DE1997135165 |