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Summary:The apparatus comprises: a process chamber 21, a susceptor 22 on which a wafer is mounted inside the process chamber, a resistance heater 29 for heating the susceptor, a lamp 28 installed at the top of the process chamber for raising the temperature of the process chamber up to a temperature required in the process, a gas injector 33 installed on one side of the process chamber for supplying gas to the process chamber, and a gas heater 34 mounted on the gas injector for preheating gas supplied to the process chamber. The wafer is held on the susceptor by vacuum supplied to a groove 24 and is lifted off the susceptor by pins 25. The lamp is used for temperatures up to 1200{C whilst the heater 29 is used for temperatures up to 500{C. The heater 34 preheats the gas to between 50 and 800{C.
Bibliography:Application Number: DE1997116707