Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul

• Main Authors: ZEHRINGER, RAYMOND., KUENTEN, CH, FREY, TONI., LA JOLLA, CALIF., US, STUCK, ALEXANDER., WETTINGEN, CH
• Format: Patent
• Language: German
• Published: 30.04.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling...