Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul

Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling...

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Bibliographic Details
Main Authors ZEHRINGER, RAYMOND., KUENTEN, CH, FREY, TONI., LA JOLLA, CALIF., US, STUCK, ALEXANDER., WETTINGEN, CH
Format Patent
LanguageGerman
Published 30.04.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling surface is provided by a metal-ceramic composite material with a thermal expansion coefficient corresponding to that of the sub-modules, the interior of the housing containing additional means for increasing the heat transfer between the cooling surface and the cooling fluid.
Bibliography:Application Number: DE19961043717