Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling...
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| Main Authors | , , |
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| Format | Patent |
| Language | German |
| Published |
30.04.1998
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| Edition | 6 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling surface is provided by a metal-ceramic composite material with a thermal expansion coefficient corresponding to that of the sub-modules, the interior of the housing containing additional means for increasing the heat transfer between the cooling surface and the cooling fluid. |
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| AbstractList | Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling surface is provided by a metal-ceramic composite material with a thermal expansion coefficient corresponding to that of the sub-modules, the interior of the housing containing additional means for increasing the heat transfer between the cooling surface and the cooling fluid. |
| Author | FREY, TONI., LA JOLLA, CALIF., US STUCK, ALEXANDER., WETTINGEN, CH ZEHRINGER, RAYMOND., KUENTEN, CH |
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| Notes | Application Number: DE19961043717 |
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| RelatedCompanies | ASEA BROWN BOVERI AG, BADEN, AARGAU, CH |
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| Snippet | Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14)... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul |
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