Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling...
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Main Authors | , , |
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Format | Patent |
Language | German |
Published |
30.04.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | Cooling device (1) has a cooling surface (3) contacted by a number of adjacent heat generation sub-modules (8a-8h) of the power semiconductor module (14) provided by the upper side of a hollow housing (2) through which a cooling fluid is passed. At least the part of the housing providing the cooling surface is provided by a metal-ceramic composite material with a thermal expansion coefficient corresponding to that of the sub-modules, the interior of the housing containing additional means for increasing the heat transfer between the cooling surface and the cooling fluid. |
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Bibliography: | Application Number: DE19961043717 |