Substrate for printed circuits

A printed circuit substrate is formed with contact points 11-14 that are used for soldering the contacts of surface mounted devices 6 into position. Two of the pads 11,12 have a shape and size that allows another device 7 to be directly located and soldered in position. The pads have a tapered profi...

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Bibliographic Details
Main Author SAITO, ICHIRO, SOMA, FUKUSHIMA, JP
Format Patent
LanguageEnglish
German
Published 20.03.1997
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit substrate is formed with contact points 11-14 that are used for soldering the contacts of surface mounted devices 6 into position. Two of the pads 11,12 have a shape and size that allows another device 7 to be directly located and soldered in position. The pads have a tapered profile in plan section and allows optimum positioning of the components.
Bibliography:Application Number: DE19961037886