Electro-optical module manufacture with double hardening of adhesive

The process secures an electro-optical component (3) into a recess (2) in the back of an optical waveguide termination socket (1). The optically and thermally hardenable epoxy adhesive (14) is deposited on the back (16) of a flange (2a). With the component positioned in the x-y plane for maximum opt...

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Bibliographic Details
Main Authors OELZE, OLIVER., 12435 BERLIN, DE, HANKE, BERND., 14109 BERLIN, DE, GRUMM, MATHIAS., 12679 BERLIN, DE, MEYER-GUELDNER, FRANK., 12347 BERLIN, DE, STEFFENSEN, ANDREAS., 12161 BERLIN, DE
Format Patent
LanguageEnglish
German
Published 26.03.1998
Edition6
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:The process secures an electro-optical component (3) into a recess (2) in the back of an optical waveguide termination socket (1). The optically and thermally hardenable epoxy adhesive (14) is deposited on the back (16) of a flange (2a). With the component positioned in the x-y plane for maximum optical coupling to the light guide, the adhesive is immediately hardened by ultraviolet illumination (30). The resulting bond is finalised in a subsequent and/or spatially separated process step by heating.
Bibliography:Application Number: DE1996136239