Halbleitereinrichtung zum Verkleinern von Wirkungen eines Rauschens auf eine interne Schaltung

Semiconductor device according to the present invention includes package frame, bonding wire, pad, first internal power supply line, second internal power supply line, internal circuit, stabilize circuit, GND package frame, GND bonding wire, GND pad, and internal GND line. Bonding wire, pad, and fir...

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Bibliographic Details
Main Author OOISHI, TSUKASA
Format Patent
LanguageGerman
Published 17.01.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Summary:Semiconductor device according to the present invention includes package frame, bonding wire, pad, first internal power supply line, second internal power supply line, internal circuit, stabilize circuit, GND package frame, GND bonding wire, GND pad, and internal GND line. Bonding wire, pad, and first and second internal power supply lines and function as a filter. As a result, noise generated by operation of internal circuit is absorbed in propagating to stabilize circuit through first internal power supply line, pad, and second internal power supply line. Therefore, effects of noise given to stabilize circuit is small.
Bibliography:Application Number: DE19961013642