Semiconductor material treatment with grinding and ultrasonic cleaning

• Main Authors: KOBLER, KARL, MATTIGHOFEN, AT, LUNDT, HOLGER., 84489 BURGHAUSEN, DE, MALCOK, HANIFI., 84489 BURGHAUSEN, DE
• Format: Patent
• Language: English; German
• Published: 19.06.1997
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; BROACHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; FILING; GRINDING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR; MACHINE TOOLS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PLANING; POLISHING; SAWING; SCRAPING; SEMICONDUCTOR DEVICES; SHEARING; SLOTTING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The method employs a microcontroller (8) programmed to operate each of an array of nozzles (2) through which a cleaning fluid (5) is directed from a reservoir (4) at the working surface (1) of the grinding tool. Each nozzle contains a transducer (6) made e.g. from tantalum or piezoceramic material and generating ultrasound at a different frequency. The transducers are excited by oscillators (7) of various intensities with links to the microcontroller, which also varies the output of cleaning fluid through the valve supplying each nozzle from the reservoir.