Semiconductor material treatment with grinding and ultrasonic cleaning

The method employs a microcontroller (8) programmed to operate each of an array of nozzles (2) through which a cleaning fluid (5) is directed from a reservoir (4) at the working surface (1) of the grinding tool. Each nozzle contains a transducer (6) made e.g. from tantalum or piezoceramic material a...

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Bibliographic Details
Main Authors KOBLER, KARL, MATTIGHOFEN, AT, LUNDT, HOLGER., 84489 BURGHAUSEN, DE, MALCOK, HANIFI., 84489 BURGHAUSEN, DE
Format Patent
LanguageEnglish
German
Published 19.06.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
BROACHING
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
FILING
GRINDING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PLANING
POLISHING
SAWING
SCRAPING
SEMICONDUCTOR DEVICES
SHEARING
SLOTTING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:The method employs a microcontroller (8) programmed to operate each of an array of nozzles (2) through which a cleaning fluid (5) is directed from a reservoir (4) at the working surface (1) of the grinding tool. Each nozzle contains a transducer (6) made e.g. from tantalum or piezoceramic material and generating ultrasound at a different frequency. The transducers are excited by oscillators (7) of various intensities with links to the microcontroller, which also varies the output of cleaning fluid through the valve supplying each nozzle from the reservoir.
Bibliography:Application Number: DE1995146988