Washing appts. for cleaning of semiconductor substrate surface

• Main Authors: OHMORI, TOSHIAKI, ITAMI, HYOGO, JP, TANAKA, HIROSHI, ITAMI, HYOGO, JP, KANNO, ITARU, ITAMI, HYOGO, JP, DOI, NOBUAKI, ITAMI, HYOGO, JP
• Format: Patent
• Language: English; German
• Published: 28.11.1996
• Edition: 6
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; FIRE-FIGHTING; GRINDING; HUMAN NECESSITIES; LIFE-SAVING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING; NOZZLES; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; POLISHING; PREVENTION OF FOULING IN GENERAL; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The appts. includes a jet nozzle (11) coupled a liq. supply device (23) and a gas supply device (22). A mixer for the liq. and gas supplies the jet nozzle and forms the cleaning droplets. Pref. the jet nozzle and mixer contain two feed lines, one for the gas and the other one for the liq.. The second feed line end section extends from outside through the first feed line wall into its inside. The second feed line end section extends in the same direction as the first feed line. Several jet nozzles may be arranged in a regular spacing such that they do not intersect.