VERFAHREN ZUR HERSTELLUNG VON ZUMINDEST EINEM OPTOELEKTRONISCHEN BAUELEMENT UND OPTOELEKTRONISCHES BAUELEMENT

The invention relates to a method for producing at least one optoelectronic component (100) comprising the following steps: A) providing an auxiliary carrier (1), B) epitaxially applying a sacrificial layer (2) on the auxiliary carrier (1), the sacrificial layer (2) containing germanium, C) epitaxia...

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Bibliographic Details
Main Authors Sundgren, Petrus, Klemp, Christoph
Format Patent
LanguageGerman
Published 18.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a method for producing at least one optoelectronic component (100) comprising the following steps: A) providing an auxiliary carrier (1), B) epitaxially applying a sacrificial layer (2) on the auxiliary carrier (1), the sacrificial layer (2) containing germanium, C) epitaxially applying a semiconductor layer sequence (3) on the sacrificial layer (2), D) removing the sacrificial layer (2) by means of dry etching (9), such that the auxiliary carrier (1) is removed from the semiconductor layer sequence (3).
Bibliography:Application Number: DE20181104970T