Leistungs-Halbleitermodul

Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semic...

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Bibliographic Details
Main Authors ATSUMI, TAKASHI, TAKAKU, YOSHIKAZU, SHIRAI, MIKIO, ISHIDA, KIYOHITO, YAGI, YUJI, NAKAGAWA, IKUO, OHNUMA, IKUO, YAMADA, YASUSHI
Format Patent
LanguageGerman
Published 20.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.
Bibliography:Application Number: DE20081101023T