Laminiertes Dämpfungsbasismaterial und Dämpfungsanordnung mit Schichtung dieses Basismaterials

A damping structure which dispenses of the connection of a resistor used for a conventional damping structure and undergoes diverse molding processings with a simpler structure, and a laminate damping base material constituting such a damping structure. A laminate damping base material made of a pie...

Full description

Saved in:
Bibliographic Details
Main Author TANIMOTO, TOSHIO
Format Patent
LanguageGerman
Published 26.08.2004
Edition7
Subjects
BLASTING
BUILDING
BUILDING MATERIALS
CEILINGS
ENGINEERING ELEMENTS AND UNITS
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
HEATING
INSULATION OR OTHER PROTECTION OF BUILDINGS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
LIGHTING
MEANS FOR DAMPING VIBRATION
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
ROOFS
SHOCK-ABSORBERS
SPRINGS
STRUCTURAL ELEMENTS
THERMAL INSULATION IN GENERAL
TRANSPORTING
WALLS, e.g. PARTITIONS
WEAPONS
Online AccessGet full text

Cover

More Information
Summary:A damping structure which dispenses of the connection of a resistor used for a conventional damping structure and undergoes diverse molding processings with a simpler structure, and a laminate damping base material constituting such a damping structure. A laminate damping base material made of a piezoelectric ceramic material or piezoelectric polymer material and a conductive fiber-reinforced plastic (FRP) composition is prepared. One to a plurality of this base material are stacked to constitute a first damping structure. A second damping structure is constituted by stacking at least a layer of piezoelectric polymer film or piezoelectric ceramic thin film between a multilayer laminate that is a laminate of conductive laminate FRP base materials.
Bibliography:Application Number: DE20021097295T