Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil

Process for connecting microstructured component layers made from metals and metal alloys comprises: (a) applying a multifunctional barrier layer on the joining surfaces of the component layers; (b) applying a solder layer on the barrier layer; (c) stacking the component layers; and (d) soldering un...

Full description

Saved in:
Bibliographic Details
Main Authors MADRY, CHRISTIAN, RINGTUNATUS, OLIVER, HERBER, RALPH, SCHWIEKENDICK, CARSTEN, CRAEMER, KONRAD, MEYER, HEINRICH, KURTZ, OLAF, FRIZ, WOLFGANG
Format Patent
LanguageGerman
Published 25.08.2005
Edition7
Subjects
APPARATUS THEREFOR
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:Process for connecting microstructured component layers made from metals and metal alloys comprises: (a) applying a multifunctional barrier layer on the joining surfaces of the component layers; (b) applying a solder layer on the barrier layer; (c) stacking the component layers; and (d) soldering under the action of heat. An Independent claim is also included for a microstructured component comprising a stack of microstructured component layers having a barrier layer and solder layer between them.
Bibliography:Application Number: DE20021051658