Production of boron-doped silicon wafer, used as substrate for electronic element, e.g. processor or memory element, includes polishing with aqueous alkaline polish containing silica and alkali metal or ammonium polyaminocarboxylate

• Main Author: WENSKI, GUIDO
• Format: Patent
• Language: English; German
• Published: 18.12.2003
• Edition: 7
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES

In producing boron-doped silicon (Si:B) wafers by dividing Si:B crystal into wafers, machining, wet chemical etching front and back to remove not less than 10 mum Si and continuously polishing at least front, to remove not less than 10 mum Si, with aqueous polish, pH 10-12, containing 0.1-10 wt.% si...