Thermoplastic molding material containing polyamide, nanoscale filler and elastomer useful in the preparation of mono- or multilayer films or hollow bodies, for packaging foodstuffs, such as meat sausages, cheese, drinks

• Main Authors: MAHLKE, MATTHIAS, SCHULTE, HELMUT, PARG, ROLAND, ULRICH, RALF, HOCH, MARTIN, SCHWARZ, PETER, SCHAEFER, MARCUS
• Format: Patent
• Language: English; German
• Published: 04.03.2004
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; METALLURGY; NANOTECHNOLOGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

A thermoplastic molding material containing at least one polyamide, at least one nanoscale filler and at least one elastomer is new. Independent claims are included for: (1) a process for preparation of the molding material by melt compounding the components, where the nanoscale filler and elastomer can be added simultaneously or separately; (2) a one- or multilayer film or hollow body obtained from the molding material. Die vorliegende Erfindung betrifft flexible Polyamidformmassen, enthaltend Polyamid, nanoskalige Füllstoffe und Elastomere, sowie Folien oder Hohlkörper, enthaltend zumindest eine Schicht aus diesen Formmassen und Verfahren zur Herstellung der Formmassen bzw. Folien und Hohlkörper.