Vorrichtung mit Substrat mit leitfähigen Säulen

A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and ele...

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Bibliographic Details
Main Authors Ng, Chee Yang, Lee, Swee Kah, Chiang, Chau Fatt, Solomko, Valentyn, Chua, Kok Yau
Format Patent
LanguageGerman
Published 19.04.2018
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
Bibliography:Application Number: DE201710218138