Cutting solar cell panel, comprises providing solar cell substrate comprising P-type layer and N-type layer, using laser for incising trench on P-type layer surface and using hot air along trench on surface of P-type layer to produce break

• Main Authors: HSU, JIH-JONG, LO, CHINGUNG, SU, CHIHIEH
• Format: Patent
• Language: English; German
• Published: 30.08.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

Cutting a solar cell panel, comprises: providing a solar cell substrate, where the solar cell substrate comprises a P-type layer and an N-type layer, which are stacked; using a laser for incising at least one trench in the surface of the P-type layer of the solar cell substrate, where the depth of the trench does not reach the N-type layer; and using hot air along the trench on the surface of P-type layer such that the trench produces a break to cut the solar cell substrate completely. An independent claim is also included for an apparatus for cutting the solar cell panel, comprising a support platform having a support surface for receiving the solar cell substrate, a laser generator, which is facing the support platform and cuts at least one trench on the surface of the P-type layer, where the trench of the solar cell substrate is not completely cut, and an air blower, which is facing the support surface and produces hot air along the trench on the surface of P-type layer to enable the trench to create a break for cutting the solar cell substrate completely. Es werden ein Verfahren zum Schneiden eines Solarzellenpanels und eine Ausrüstung dafür offenbart. Das Verfahren umfasst die Schritte: Bereitstellen eines Solarzellensubstrats, wobei das Solarzellensubstrat eine P-Schicht und eine N-Schicht umfasst, die aufeinander gestapelt sind; Verwenden eines Lasers, um mindestens einen Graben auf der Oberfläche der P-Schicht des Solarzellensubstrats einzuritzen, wobei die Tiefe des Grabens nicht die N-Schicht erreicht; und Anwenden von heißer Luft entlang dss der Graben einen Bruch erzeugt, um das Solarzellensubstrat vollständig zu schneiden.