Endless band shaped structure for retaining e.g. power LEDs, has reflecting film covering strip guard structure, where reflecting film is left blank in punched receiving areas utilized for retaining electronic parts

• Main Author: HACKERT, JUERGEN
• Format: Patent
• Language: English; German
• Published: 26.04.2012
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; NON-PORTABLE LIGHTING DEVICES; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SYSTEMS THEREOF; TRANSPORTING; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The structure (1) has a flexible solderable strip guard structure (3) applied on a side of the band shaped structure, where the band shaped structure is formed as a flexible structure from a double sided adhesive band (2). The strip guard structure is covered with a reflecting film (4), where the reflecting film is left blank in punched receiving areas (13) utilized for retaining electronic parts. A semiconductor light source i.e. power LED, is applied on a top face of a flexible substrate. The strip guard structure has a copper foil with thickness of about 5 to 200 micrometers. The reflecting film is made of silicone-coated and/or UV-resistant paper, plastic film, or vaporized reflector film. The bottom and/or top face of the double sided adhesive band in the region of the electronic parts is applied with heat-conductive and electrically non-conductive material such as carbon powder or power containing carbon compounds. Independent claims are also included for the following: (1) a method for manufacturing a band shaped structure (2) a device for manufacturing a band shaped structure. Die Erfindung betrifft eine bandförmige Struktur zur Aufnahme von elektronischen Bauteilen, insbesondere von Power-LED'S, sowie ein Verfahren und eine Vorrichtung zur Herstellung der bandförmigen Struktur. Die bandförmige Struktur (1) als flexible Struktur besteht aus einem doppelseitigem Klebeband (2) und ist auf der einen Seite mit einer flexible lötfähige Leiterbahnstruktur (3) versehen und mit einer reflektierenden Folie (4) abgedeckt, wobei die reflektierende Folie (4) im Bereich der Aufnahme (13) der aufzubringenden elektronischen Bauteile ausgespart ist.