Elektronikkühler und Verfahren zum Herstellen eines Elektronikkühlers

• Main Authors: HIMMER, THOMAS, MOSER, MICHAEL, RIEDEL, RUDOLF, STEINBACH, MARTIN, HECKENBERGER, THOMAS, MOLDOVAN, FLORIAN, SCHIEHLEN, THOMAS
• Format: Patent
• Language: German
• Published: 24.11.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; WEAPONS

Die vorliegende Erfindung betrifft einen. Elektronikkühler mit einem Kühlkörper (1), der eine Mehrzahl von Fluidkanälen und eine Wärmeübertragungsfläche (2) zum Aufsintern mindestens eines Elektronikbauteils aufweist. The cooler has a cooling body (1) including a set of fluid channels and a heat transfer surface (2) for sintering an electronics component. The electronics component is sintered on the heat transfer surface. The cooling body is formed as an extruding profile from material such as aluminum, and includes a geometrical structure, which is designed depending on temperature and pressure acting during sintering on the heat transfer surface. The fluid channels are formed from respective channel plates of the cooling body and arranged transverse to each other. The electronics component is selected from a group consisting of a MOSFET, an insulated-gate bipolar transistor, a transistor and power electronics. An independent claim is also included for a method for manufacturing an electronics cooler.