Power Quad Flat No-Lead-Halbleiter-Chip-Packages mit isolierter Wärmesenke für Hochspannungs-, Hochleistungsanwendungen, Systeme zum Verwenden dieser und Verfahren zum Herstellen dieser

Disclosed are PQFN semiconductor die packages for high-voltage, high-power applications, systems using the packages, and methods of making the packages. An exemplary package comprises a leadframe, a semiconductor die disposed on the leadframe, and a heat sink member disposed on the semiconductor die...

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Bibliographic Details
Main Authors SON, JOON-SEO, JEREZA, ARMAND VINCENT, MANATAD, ROMEL N
Format Patent
LanguageGerman
Published 14.10.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed are PQFN semiconductor die packages for high-voltage, high-power applications, systems using the packages, and methods of making the packages. An exemplary package comprises a leadframe, a semiconductor die disposed on the leadframe, and a heat sink member disposed on the semiconductor die and the leadframe and integrated into the molding material of the package. The heat sink member has an electrically insulating substrate with a high breakdown voltage, and one or more conductive layers disposed on a first surface of the substrate that electrically interconnect the semiconductor to one or more leads of the leadframe.
Bibliography:Application Number: DE20091056787