Verfahren zur gratfreien trennenden Bearbeitung von Werkstücken

• Main Authors: HIMMER, THOMAS, STELZER, SEBASTIAN, LUETKE, MATTHIAS
• Format: Patent
• Language: German
• Published: 09.06.2011
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to a method for separatively processing workpieces in a burr-free manner by means of a focused laser beam that can be deflected in two dimensions. In the method according to the invention, a laser beam emitted by a single-mode fiber laser or a disk laser is directed at a workpiece surface to form a laser kerf in such a way that material removal is achieved only by ablation and the focal point of the laser beam is moved multiple times over the same positions of the workpiece surface along a cutting contour to be formed in a first phase of the processing. The processing parameters of the method are changed in at least one subsequent further phase of the processing before the workpiece has been completely divided, and the focal point of the laser beam is moved along the cutting contour to be formed at least once with changed parameters, and thus remelting and/or material removal can be achieved at the edges of the kerf.