Lotkontakt
Zur Herstellung eines Lotkontakts (11) zwischen einem Verbindungs-Element (12) und einer Kontakt-Struktur (5) eines Halbleiter-Bauelements (1) ist ein niederschmelzendes Lot vorgesehen. A low melting temperature solder is provided for producing a solder contact between a connection element and a con...
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| Main Authors | , , |
|---|---|
| Format | Patent |
| Language | German |
| Published |
21.01.2010
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Zur Herstellung eines Lotkontakts (11) zwischen einem Verbindungs-Element (12) und einer Kontakt-Struktur (5) eines Halbleiter-Bauelements (1) ist ein niederschmelzendes Lot vorgesehen.
A low melting temperature solder is provided for producing a solder contact between a connection element and a contact structure of a semiconductor component. |
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| AbstractList | Zur Herstellung eines Lotkontakts (11) zwischen einem Verbindungs-Element (12) und einer Kontakt-Struktur (5) eines Halbleiter-Bauelements (1) ist ein niederschmelzendes Lot vorgesehen.
A low melting temperature solder is provided for producing a solder contact between a connection element and a contact structure of a semiconductor component. |
| Author | BITNAR, BERND SCHMIDT, HARTMUT KRAUSE, ANDREAS |
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| Notes | Application Number: DE20081031836 |
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| RelatedCompanies | DEUTSCHE CELL GMBH |
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| Snippet | Zur Herstellung eines Lotkontakts (11) zwischen einem Verbindungs-Element (12) und einer Kontakt-Struktur (5) eines Halbleiter-Bauelements (1) ist ein... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Lotkontakt |
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