Verfahren zur Herstellung einer strukturierten Bodenelektrode in einem piezoelektrischen Bauelement
The method involves providing a base material (100), and producing a laminated structure (133) on the base material, where the structure has a conductive material. A protective layer (140) is produced on the structure. A planarization layer is applied on the layer (140) and the base material. A sect...
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Main Authors | , |
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Format | Patent |
Language | German |
Published |
03.01.2008
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Subjects | |
Online Access | Get full text |
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Summary: | The method involves providing a base material (100), and producing a laminated structure (133) on the base material, where the structure has a conductive material. A protective layer (140) is produced on the structure. A planarization layer is applied on the layer (140) and the base material. A section of the layer (140) is formed by structuring of the planarization layer, where the layers are laterally adjoined and form a planar surface. The layer (140) and an appropriate part of the planarization layer are removed in order to obtain a planar surface of the layers. |
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Bibliography: | Application Number: DE20061019505 |