Kondensatormodul

The module has a cup-shaped module housing (1) and a set of capacitors (5) arranged in the housing. A gap (A) is provided between two adjacent condensers, where the module housing is sealed externally. The module housing is filled with a medium e.g. polyurethane, which has a high thermal conductivit...

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Main Authors JOSSEN, ANDREAS, BRAZEL, HARALD, ZHANG, WEIBO, DOERING, HARRY, SCHWAKE, ANDREE, SETZ, MICHAEL, SCHMID, BERNHARD, GOESMANN, HUBERTUS, WEBER, CHRISTOPH J, WOERZ, MICHAEL
Format Patent
LanguageGerman
Published 16.10.2008
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Summary:The module has a cup-shaped module housing (1) and a set of capacitors (5) arranged in the housing. A gap (A) is provided between two adjacent condensers, where the module housing is sealed externally. The module housing is filled with a medium e.g. polyurethane, which has a high thermal conductivity as air. The capacitors are formed with housings (6), which have a thermal transfer coefficient that is larger or equal to 0.4.
Bibliography:Application Number: DE20041045182