Kondensatormodul
The module has a cup-shaped module housing (1) and a set of capacitors (5) arranged in the housing. A gap (A) is provided between two adjacent condensers, where the module housing is sealed externally. The module housing is filled with a medium e.g. polyurethane, which has a high thermal conductivit...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | German |
Published |
16.10.2008
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Subjects | |
Online Access | Get full text |
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Summary: | The module has a cup-shaped module housing (1) and a set of capacitors (5) arranged in the housing. A gap (A) is provided between two adjacent condensers, where the module housing is sealed externally. The module housing is filled with a medium e.g. polyurethane, which has a high thermal conductivity as air. The capacitors are formed with housings (6), which have a thermal transfer coefficient that is larger or equal to 0.4. |
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Bibliography: | Application Number: DE20041045182 |