Verfahren zur Herstellung von Substraten für Fotomaskenrohlinge

A photomask blank substrate is made by polishing a starting substrate to a specific flatness in a principal surface region on a top surface of the substrate so as to form a polished intermediate product, then additionally polishing the intermediate product. Substrates made in this way exhibit a good...

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Bibliographic Details
Main Authors Mogi, Masayuki, Numanami, Tsuneo, Kondo, Naoto, Hagiwara, Tsuneyuki, Nakatsu, Masayuki
Format Patent
LanguageGerman
Published 20.09.2018
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
HOLOGRAPHY
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS THEREFOR
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A photomask blank substrate is made by polishing a starting substrate to a specific flatness in a principal surface region on a top surface of the substrate so as to form a polished intermediate product, then additionally polishing the intermediate product. Substrates made in this way exhibit a good surface flatness at the time of wafer exposure. When a photomask fabricated from a blank obtained from such a substrate is held on the mask stage of a wafer exposure system with a vacuum chuck, the substrate surface undergoes minimal warping, enabling exposure patterns of small geometry to be written onto wafers to good position and linewidth accuracies.
Bibliography:Application Number: DE20041035617