Production of a lens made from a gallium phosphide-based semiconductor material comprises preparing a substrate from the semiconductor material, applying a photolacquer on the substrate, structuring the layer and etching the photolacquer
Production of a lens made from a gallium phosphide (GaP) based semiconductor material comprises: (a) preparing a substrate made from a GaP-based semiconductor material; (b) applying a photolacquer on the substrate; structuring the layer and rounding into a lacquer lens by heating; and (c) etching th...
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Main Authors | , , |
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Format | Patent |
Language | English German |
Published |
03.04.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | Production of a lens made from a gallium phosphide (GaP) based semiconductor material comprises: (a) preparing a substrate made from a GaP-based semiconductor material; (b) applying a photolacquer on the substrate; structuring the layer and rounding into a lacquer lens by heating; and (c) etching the photolacquer and the substrate in a plasma etching process. Preferably the substrate is etched against the photolacquer layer with a selectivity of 0.5-4. The flow of process gases introduced during the plasma etching is adjusted so that the selectivity of the etching of the semiconductor layer/photolacquer remains constant. During plasma etching, Cl2 or SiCl4, a noble gas, a fluorine compound and a hydrogen compound are introduced.
Bei einem Verfahren zum Herstellen einer Linse aus GaP-basiertem Halbleitermaterial, wird DOLLAR A - ein Substrat aus GaP-basiertem Halbleitermaterial bereitgestellt, DOLLAR A - eine Photolackschicht auf das Substrat aufgebracht, DOLLAR A - die Photolackschicht strukturiert und durch Ausheizen zu einer Lacklinse verrundet und DOLLAR A - die verrundete Photolackschicht und das Halbleitersubstrat gemeinsam in einem Plasmaätzprozeß geätzt. |
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Bibliography: | Application Number: DE2001142010 |