Elektronische Baugruppe

An electronic module (1) has bonding links (12) for electrical contact with at least one electronic component (5) mounted on a carrier body (4) and/or of a conduction path structure on the carrier body (4) and/or of connection contacts (11). At least one part of the bonding links (12) is formed by a...

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Bibliographic Details
Main Authors HIEMER, GERHARD, PABST, THOMAS, JESINGER, GUENTHER, BAEUMEL, HERMANN, GEORGE, DIETRICH
Format Patent
LanguageGerman
Published 30.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic module (1) has bonding links (12) for electrical contact with at least one electronic component (5) mounted on a carrier body (4) and/or of a conduction path structure on the carrier body (4) and/or of connection contacts (11). At least one part of the bonding links (12) is formed by a bonding wire (17) provided with an insulating layer (19).
Bibliography:Application Number: DE20011029006