Copolycarbonate composition with high stress cracking resistance, used for electrical component housings, comprises thermoplastic aromatic copolycarbonate including 4,4'-dihydroxybiphenyl units, and a rubber grafted with vinyl monomers

Copolycarbonate composition comprises: (a) a thermoplastic aromatic copolycarbonate including 4,4'-dihydroxybiphenyl units; and (b) a rubber grafted with vinyl monomers. Copolycarbonate composition comprises: (a) a thermoplastic aromatic copolycarbonate derived from a bisphenol mixture consisti...

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Bibliographic Details
Main Authors WARTH, HOLGER, ECKEL, THOMAS, KRATSCHMER, SILKE, WITTMANN, DIETER
Format Patent
LanguageEnglish
German
Published 06.06.2002
Edition7
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Copolycarbonate composition comprises: (a) a thermoplastic aromatic copolycarbonate including 4,4'-dihydroxybiphenyl units; and (b) a rubber grafted with vinyl monomers. Copolycarbonate composition comprises: (a) a thermoplastic aromatic copolycarbonate derived from a bisphenol mixture consisting of 4,4'-dihydroxybiphenyls of formula (I) (0.1-46 mol.%) and other bisphenols (54-99.9 mol.%) (2-98 parts by weight, (pbw)); and (b) a graft compolymer consisting of vinyl monomer(s) (5-90 wt.%) and a rubber with a glass transition temperature of 10 deg C or less (10-95 wt.%) (1-50 pbw). R - R = H, halo, 1-8C alkyl, 1-5C cycloalkyl, 6-10C aryl or 7-12C aralkyl. Die Erfindung betrifft thermoplastische Copolycarbonat-Zusammensetzungen und diese enthaltende Formkörper mit erhöhter Spannungsrissbeständigkeit und Thermostabilität.
Bibliography:Application Number: DE2001105714