Verfahren zur galvanischen Beschichtung von Hochtemperatur-Supraleitern mit Cu-Verbindungen

• Main Authors: ROTHFELD, ROLF, FLOEGEL-DELOR, UTA, WERFEL, FRANK, WIPPICH, DIETER
• Format: Patent
• Language: German
• Published: 15.05.2003
• Edition: 7
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to a method for metal coating the surface of high temperature superconductors with a copper-oxygen base structure. The aim of the invention is to achieve a method as above, which requires a low production complexity, serves for the production of contacts with a low electrical and/or thermal transfer resistance and which increases the stability of the metallization. Said aim is achieved whereby copper is applied to give low-ohmic contacts, and the linked achievement of a stable metallization between the HTS and the electrical and/or thermal coupling. Further advantageous effects are achieved with the method whereby the copper is applied in the form of copper alloys, in particular as copper-nickel or copper-zinc alloys. On applying the method it is furthermore of advantage for the creation of fine grained surface coatings to overlay the galvanic cell with a permanent and/or alternating magnetic field.