A method of preparing a bimodal mixture of nanoparticles and copper microparticles with a polymeric protective layer

• Main Authors: Kubáč Lubomír, Macák Jan, Josefík František, Wágner Tomáš, Syrový Tomáš
• Format: Patent
• Language: Czech; English
• Published: 27.12.2017
• Subjects: ALLOYS; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASTING; CHEMISTRY; FERROUS OR NON-FERROUS ALLOYS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT THEREOF; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; METALLURGY; NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS,MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES ASDISCRETE UNITS; NANOTECHNOLOGY; PERFORMING OPERATIONS; POWDER METALLURGY; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WORKING METALLIC POWDER

The invention relates to a method for preparation of a bimodal mixture of copper nanoparticles and microparticles with a polymeric protective layer, in which in the first step is prepared a reaction mixture containing at least one precursor of copper, an aqueous solution of at least one monohydric and/or polyhydric alcohol and at least one organic polymer in a weight ratio of a precursor (precursors) of copper : alcohol (alcohols) : organic polymer (polymers) 1 : 5-500 : 0.05-0.5, and in the second step at least one organic reducing agent is quantitatively added to this reaction mixture under intensive stirring, the weight ratio of precursor (precursors) of copper : organic reducing agent (agents) being 1 : 1-20, whereby from the reaction mixture under constant intensive stirring are simultaneously reduced and precipitated copper nanoparticles and microparticles, which are provided with a protective layer of organic polymer (a mixture of organic polymers). The invention also relates to a bimodal mixture of copper nanoparticles and microparticles with a protective layer of polymer prepared by this method, and a printing formulation for printing electrically conductive layers, which contains 55 to 85 % by weight of this mixture.