THERMAL INSULATION COMPOUND GYPSUM BOARD

The utility model discloses a thermal insulation compound board in exterior walls, the thermal insulation compound board is compounded by thistle boards, polystyrene foamed plastic boards and gypsum reinforcing strips. The utility model has the advantages of easy fabrication, convenient construction...

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Bibliographic Details
Main Authors ZHU WENPENG, JIN CHENG, YANG PINGPING, DONG LIZHOU, XIA JIZHEN
Format Patent
LanguageEnglish
Published 22.06.1988
Edition4
Subjects
BUILDING
CEILINGS
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
ROOFS
WALLS, e.g. PARTITIONS
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Summary:The utility model discloses a thermal insulation compound board in exterior walls, the thermal insulation compound board is compounded by thistle boards, polystyrene foamed plastic boards and gypsum reinforcing strips. The utility model has the advantages of easy fabrication, convenient construction.
Bibliography:Application Number: CN1987213134U