THERMAL INSULATION COMPOUND GYPSUM BOARD
The utility model discloses a thermal insulation compound board in exterior walls, the thermal insulation compound board is compounded by thistle boards, polystyrene foamed plastic boards and gypsum reinforcing strips. The utility model has the advantages of easy fabrication, convenient construction...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
22.06.1988
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Edition | 4 |
Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a thermal insulation compound board in exterior walls, the thermal insulation compound board is compounded by thistle boards, polystyrene foamed plastic boards and gypsum reinforcing strips. The utility model has the advantages of easy fabrication, convenient construction. |
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Bibliography: | Application Number: CN1987213134U |