METHOD FOR DETECTING AND CORRECTING FAILURE IN MOUNTING OF ELECTRONIC PARTS ON SUBSTRATE AND APPARATUS THEREFOR

A method and apparatus for detecting and enabling correction of a failure in the mounting of electronic parts on substrates, capable of automatically and efficiently accomplishing the detection of a failure in the mounting of electronic parts on substrates, and classification between failed substrat...

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Bibliographic Details
Main Author MASATOSHI OOTA
Format Patent
LanguageEnglish
Published 10.06.1987
Edition4
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TESTING
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Summary:A method and apparatus for detecting and enabling correction of a failure in the mounting of electronic parts on substrates, capable of automatically and efficiently accomplishing the detection of a failure in the mounting of electronic parts on substrates, and classification between failed substrates and acceptable substrates to improve the overall operation efficiency of an electronic parts mounting line. The method is adapted to apply a code mark to each substrate on which electronic parts are to be mounted, detect a failure the mounting after, read and store the code marks and failure data of failed substrates, and classify the failed substrates from acceptable substrates and transfer the failed substrates on the basis of the code marks and failure data stored.
Bibliography:Application Number: CN19861004342